Deposition Sciences, Inc. (DSI) introduces thin film solderable coatings and face metallization, available on a wide variety of substrates. Although silicon is the most frequently used substrate, the coatings can be applied to virtually all commonly used optical materials. The new thin film coating capabilities are enabled by DSI’s proprietary MicroDyn sputtering deposition technology.
The face metallization and solderable coatings are typically used for hermetic sealing of sensitive packages. They can be combined with anti-reflective (AR), bandpass, or precision custom coatings from the ultraviolet (UV), out to the longwave infrared (LWIR) wavelengths. Applications include infrared detectors, cameras, focal plane arrays, and other sealed sensors and/or detectors.