CHOMERICS
Premier conductive thermoplastics are formulated to provide high performance EMI shielding and grounding in electronic devices. Premier molded plastic parts feature a dispersion of long, nickel-plated carbon fibers in a choice of resin matrices. The long fiber manufacturing process is an improvement over other methods that were susceptible to breakdown and inconsistent fiber contact. The high content of evenly dispersed, randomly oriented fibers permits integration of shielding into housings without additional processing steps such as plating, painting, or vacuum coating.
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RTP CO.
Specialty compounds containing hollow glass microspheres can reduce part weight, enhance properties, and lower part cost in demanding applications. Some of the benefits include lower viscosity, improved flow, reduced shrinkage, and reduced warpage. The use of glass bubbles also provides more uniform control and reproducibility than other methods typically used for weight reduction. The glass bubbles are noncombustible, nonporous and do not absorb moisture. The produce stable voids, resulting in low thermal conductivity and low dielectric constants.
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BASF
High-impact polystyrene (HIPS) 473D is a high-flow, injection molding grade resin with excellent processability and toughness. It has been especially formulated to achieve enhanced corner strength, a critical measure of toughness and durability in injection molded parts. The HIPS can be used in a wide variety of applications, including consumer electronics, office equipment, and personal care products.
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